[SI-LIST] : Bonding options to short Busses on a die

R.S. Krishnan ([email protected])
Thu, 17 Jun 1999 19:08:01 +0531


I am investigating options to short power / ground busses using
bonding techniques rather than having to tape out another mask.

I would also appreciate information on vendors, cost, and commercial
viability of the method.

The die is bondable to 56/48pin SSOP plastic package.

Thanks in advance for any help

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