From: Neeraj Pendse ([email protected])
Date: Fri May 18 2001 - 11:42:38 PDT
Larry and anyone,
Have you found a way to predict resonance in BGA packages based on the
frequency, package size and substrate stack-up? And do you have any
advice on when I should be concerned about dying because of package
resonance?
Regards,
Neeraj.
National Semiconductor Corp.
http://www.national.com NYSE: NSM
>>>>>>>>>>>>>>>>>> Original Message <<<<<<<<<<<<<<<<<<
On 5/18/01, 6:22:48 AM, Larry Miller <[email protected]>
wrote regarding RE: [SI-LIST] : BGA Pkg Characterization:
> You really do need to do this if you are contemplating usage up above
300
> MHz. Many packages have simply awful resonances and crosstalk, and it
varies
> hugely with where you are on the package. I have found 4:1 variations
in
> lowest resonance frequencies in a single package due to the variations
in
> the way the signals get from the chip bonding pads to the balls. Also,
you
> need to test groups of signals. Various sets can resonate in pairs,
etc.
> Good luck!
> Larry Miller
> -----Original Message-----
> From: Wesley Wu [mailto:[email protected]]
> Sent: Tuesday, May 15, 2001 8:23 PM
> To: SI_LIST (E-mail)
> Subject: [SI-LIST] : BGA Pkg Characterization
> Hi All,
> Has anybody done characterization on existing BGA packages recently? I
need
> to
> know if there is anyone who can do this for me and what is the
estimated
> cost. The
> required measurements include characteristic impedance along traces,
delay
> and
> gain on both directions of traces across the frequency band of 500M -
2GHz,
> ground
> bounce, cross talking, and ringing. I would like to obtain a data
range for
> all
> these to see if some particular BGA packages are suitable for my
> applications.
> Ideally I would like to add some equivalent to bond wire and IC input
> capacitance
> during test. Your help is greatly appreciated.
> Wesley Wu
> RedSwitch, Inc.
> (408)719-4748
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