From: Ricchiuti Vittorio ([email protected])
Date: Tue Mar 20 2001 - 02:37:43 PST
Hi all.
Can someone send me the following paper?
Q. Yu, O. Wing : "SPICE simulation of VLSI interconnects modeled by
transmission lines with skin effects", Proceedings of IEEE Electrical
Performance of Electronic Packaging, 20-22 october 1993
I have not the possibility to obtain it from my library.
Thanks and regards
Vittorio
ing. Vittorio Ricchiuti
CAD support and SI engineer
Siemens ICN
Loc. Boschetto
67100-L'Aquila
ITALY
Tel: +39/0862/335880
Fax: +39/0862/335623
e-mail: [email protected]
**** To unsubscribe from si-list or si-list-digest: send e-mail to
[email protected]. In the BODY of message put: UNSUBSCRIBE
si-list or UNSUBSCRIBE si-list-digest, for more help, put HELP.
si-list archives are accessible at http://www.qsl.net/wb6tpu
****
This archive was generated by hypermail 2b29 : Thu Jun 21 2001 - 10:11:16 PDT