From: Alina Deutsch ([email protected])
Date: Fri Apr 20 2001 - 05:38:58 PDT
Dear SI subscribers,
I am posting the final update of the program for the Future Directions in
IC and Package Design, FDIP'2001, workshop
that will be held Oct. 27, 2001 in Cambridge, MA, the Saturday before the
start of the 10th Topical Meeting on Electrical
Performance of Electronic Packaging, EPEP'2001, conference, that will run
Oct. 29-31, 2001.
Please note the great set of invited speakers from around the world that
will give us their expert views on the future.
The workshop offers free admission for all attendees of EPEP'2001. Please
note the September 28, 2001 registration deadline.
It is also strongly recommended to make reservations with the hotel early
in order to obtain the discounted rates offered for EPEP
attendees.
See you all in October in Cambridge !
Alina Deutsch
Final Program
Future Directions in IC and Package Design Workshop (FDIP)
sponsored by:
IEEE Components, Packaging, and Manufacturing Society
October 27, 2001
Royal Sonesta Hotel
Cambridge, Massachusetts
The goal of this new workshop is to provide a forum to address the future
needs associated with the design of next generation ICs and packages. The
Technical Program Committee solicited invited presentations from experts in
the university and industrial communities. The workshop is held in
conjunction with the 10th IEEE Topical Meeting on Electrical Performance of
Electronic Packaging (EPEP 2001) in order to enhance this conference with
presentations that give directions for future requirements and developments
in the area of electrical analysis and design. The workshop will foster
active participation and discussions from all the speakers and attendees
during the meeting.
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Workshop Chairs:
Alina Deutsch Madhavan Swaminathan
IBM Watson Research Center Georgia Institute of
Technology
Technical Program Committee:
Ronald Bracken - SRC Mahadevan Iyer - IME,
Singapore
Andreas Cangellaris - University of Illinois George Katopis
- IBM Poughkeepsie
Moises Cases - IBM Austin Istvan Novak - SUN
Chi-Shih Chang - X-LAM Technologies Toshio Sudo -
Toshiba, Japan
Paul Franzon - North Carolina State University Gregory Taylor
- Intel Oregon
Hartmut Grabinski - University of Hanover, Germany Lewis Terman -
IBM Watson Research
Harold Hosack - Semiconductor Res. Corp. Ryszard Vogel
- Nokia, Finland
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Program
11:00 am - 1:30 pm Registration for workshop and EPEP
Charles B Room
1:15 - 1:30 pm Welcome Remarks, Madhavan Swaminathan, GIT, Alina
Deutsch, IBM
SESSION I: SYSTEM DESIGN
1:15 - 3:00 pm
Session Chair: Chi-Shih Chang, Kulicke & Soffa
1. Next Generation System Design Challenges and Opportunities
Derek Tsai, SUN Microsystems
2. System and Package Design Using the Low-Power Transmeta Processor
Robert Montoye, IBM
3. Optimization of Electrical Package Design and PCB Design for CSP Age
Atsushi Nakamua, Hitachi, Japan
3:00 - 3:45 pm - Refreshment Break
SESSION II: TECHNOLOGY AND TOOLS
3:45 - 5:30 pm
Session Chair: Harold Hosack, Semiconductor Research Corporation
4. Integration of RF Elements and Passives for Telecommunication
Paul Collander, P. Laukkala, R. Vogel, Nokia Networks, Finland
5. Optical Interconnections Inside the Processor Box
Lewis Terman, IBM Watson Research Center
6. Fast Solvers and "Full Problem Analysis", the Remaining Challenges
Jacob White, MIT
5:15 - 5:30 pm Closing Remarks, Madhavan Swaminathan, GIT, Alina
Deutsch, IBM
Workshop will be held at the Royal Sonesta Hotel. The address is 5
Cambridge Parkway, Cambridge, Massachusetts 02142-1299, phone: (617)
491-3600, fax: (617) 661-5956. The hotel is holding a block of rooms for
participants at a special rate of $125 and the rest at $195 plus 4% city
tax and 2.75% CCF tax. Reservations must be made by calling the hotel
directly by October 7, 2001 to receive these rates.
Additional information may be obtained from the workshop chairs:
Alina Deutsch Madhavan Swaminathan
[email protected]
[email protected]
phone: (914) 945-2858 phone: (404) 894-3340
fax: (914) 945-2141 fax: (404) 894-9959
and the workshop administration:
Paul Baltes
[email protected]
phone: (520) 621-3054
fax: (520) 621-1443
Updates will be posted at the workshop web site at:
http://www.cpmt.org/conf/fdip01/fdip.html and http://www.epep.org. The
workshop is open to all attendees of the IEEE Topical Meeting on Electrical
Performance of Electronic Packaging. Attendees interested in only the
workshop will be charged a $50.0 fee which will cover refreshments and
digest of abstracts. All attendees must register by September 28, 2001 by
sending email to [email protected] in order to assure adequate services.
On-site registrants will be admitted depending on availability of seating.
Please indicate if planning to attend EPEP'2001.
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