From: Bernard Voss ([email protected])
Date: Wed Apr 18 2001 - 08:27:44 PDT
Javin,
I have successfully used 1/2 oz. Cu for < 200Mhz, TTL and CMOS signal
routing on dozens of 4-12 layer desktop computer and telecom cards. Be
aware, the finished metal thickness of 1/2 oz. foil (0.0006") or clad
laminate will increase to ~1.0oz Cu (0.0012" thick) on the outer layers due
to the Cu plating that outer layers experience during fabrication.
Bernard
Javin Olson wrote:
> I am working with a customer that is pushing for 1/2 oz copper for a
> high speed board consisting of 2.5Gbps CML, 622Mhz LVDS, on down to
> 33Mhz processor speeds. I can see where moving to 1/2 oz copper will
> not affect the high speed signals that much since most of the signal
> will be on the surface of the high speed signal traces.
>
> I am wondering though, how much, and what effect will the 1/2 oz copper
> have on the normal TTL and CMOS signals running at 33-100Mhz?
>
> --------------------------------------------
> Javin Olson
> Plexus Technology Group
> Design Engineer
> 920-969-6171
>
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-- Bernard Voss Principal Interconnect Specialist SiQual, Signal Quality Engineering 18735 SW Boones Ferry Road Tualatin, OR 97062-3090 (503) 885-1231 http://www.siqual.com**** To unsubscribe from si-list or si-list-digest: send e-mail to [email protected]. In the BODY of message put: UNSUBSCRIBE si-list or UNSUBSCRIBE si-list-digest, for more help, put HELP. si-list archives are accessible at http://www.qsl.net/wb6tpu ****
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