[SI-LIST] : paper

From: Ricchiuti Vittorio ([email protected])
Date: Tue Mar 20 2001 - 02:37:43 PST

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Hi all.
Can someone send me the following paper?

Q. Yu, O. Wing : "SPICE simulation of VLSI interconnects modeled by
transmission lines with skin effects", Proceedings of IEEE Electrical
Performance of Electronic Packaging, 20-22 october 1993

I have not the possibility to obtain it from my library.

Thanks and regards
Vittorio

ing. Vittorio Ricchiuti
CAD support and SI engineer
Siemens ICN
Loc. Boschetto
67100-L'Aquila
ITALY
Tel: +39/0862/335880
Fax: +39/0862/335623
e-mail: [email protected]

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