Future Directions in IC and Package Design Workshop
CPMT Technical Committee on Electrical Design, Modeling, and Simulation (TC-12)
October 27, 2001
Royal Sonesta Hotel
The goal of this new workshop is to provide a forum to address the future needs associated with the design of next generation ICs and packages. The Technical Program Committee will solicit invited presentations from experts in the university and in ustrial communities. The workshop will be held in conjunction with the IEEE Topical Meeting on Electrical Performance of Electronic Packaging in order to enhance this conference with presentations that give directions for future requirements and developme ts in the area of electrical analysis and design. These invited talks will address the following areas:
The workshop will foster active participation and discussions from all the speakers and attendees during the meeting.
Alina Deutsch Madhavan Swaminathan IBM Watson Research Center Georgia Institute of Technology
Technical Program Committee:
Ronald Bracken - SRC Harold Hosack - SRC Andreas Cangellaris - University of Illinois Mahadevan Iyer - IME, Singapore Moises Cases - IBM Austin George Katopis - IBM Poughkeepsie Chi-Shih Chang - International SEMATECH, Inc. Toshio Sudo - Toshiba, Japan Paul Franzon - North Carolina State University Gregory Taylor - Intel Oregon Hartmut Grabinski - Univ. of Hanover, Germany Lewis Terman - IBM Watson Research
Workshop will be held at the Royal Sonesta Hotel. The address is 5 Cambridge Parkway, Cambridge, Massachusetts 02142-1299, phone: (617) 491-3600, fax: (617) 661-5956. The hotel is holding a block of rooms for participants at a special rate of $125 and he rest at $195 plus 4% city tax and 2.75% CCF tax. Reservations must be made by calling the hotel directly by October 7, 2001 to receive these rates.
Additional information may be obtained from the workshop chairs:
Alina Deutsch Madhavan Swaminathan firstname.lastname@example.org email@example.com phone: (914) 945-2858 phone: (404) 894-3340 fax: (914) 945-2141 fax: (404) 894-9959
and the workshop administration:
phone: (520) 621-3054
fax: (520) 621-1443
The workshop is open to all attendees of the IEEE Topical Meeting on Electrical Performance of Electronic Packaging. Attendees interested in only the workshop will be charged a $50.0 fee which will cover lunch, refreshments, and digest of abstracts.