Signal Integrity Documents

(additional related documents are available at: http://groups.yahoo.com/group/si-list/files/)
by Larry Smith, Raymond Anderson, Doug Forehand, Tom Pelc, Tanmoy Roy
Sun Microsystems Inc.

published in IEEE Transactions on Advanced Packaging August, 1999 pp 284-291









 


by Tanmoy Roy, Larry Smith
Sun Microsystems Inc.
and
John Prymak
Kemet Electronic Corporation

presented at the IEEE Electrical Performance of Electronic Packaging Conference (EPEP), Oct. 1998



Simultaneous Switch Noise and Power Plane Bounce for CMOS Technology

by Larry Smith
Sun Microsytems Inc.

presented at IEEE Electrical Performance of Electrical Packaging (EPEP) Conference
San Diego, CA  Oct. 17-25, 1999

and at

The Santa Clara Valley Chapter of the IEEE EMC Society,
 Feb 8, 2000
 



Decoupling Capacitor Calculations for CMOS Circuits

by Larry Smith
Sun Microsystems Inc.

presented at IEEE Electrical Performance of Electrical Packaging (EPEP) Conference 1994


Power Plane Spice Models for Frequency and Time Domains

by Larry Smith, Raymond Anderson, Tanmoy Roy
Sun Microsystems Inc.
 

presented at IEEE Electrical Performance of Electrical Packaging (EPEP) Conference 2000 (EPEP2000)
October 2000    Scottsdale, Arizona