From: [email protected]
Date: Wed Feb 28 2001 - 07:59:47 PST
Several months ago we had a long discussion on this mailing list about how power
and ground planes interact with the decoupling capacitors on multilayer boards.
I just ran across two additional papers on modeling power/ground planes at the
Institute of Electronics, Information and Communication Engineers (Japan)
Harada, Takashi, Sasaki, Hideki, Kami, Yoshio, "Investigation of Radiated
Emission Characteristics of Multilayer Printed Circuit Boards," IEICE
Transactions on Communications, vol. E80-B no. 11, pp. 1645-1651, Nov. 1997.
(download from http://search.ieice.org/1997/pdf/b111645.pdf)
Harada, Takashi, Sasaki, Hideki, and Kami, Yoshio, "Controlling Power-Plane
Resonance in Multilayer Printed Circuit Boards," IEICE Transactions on
Communications, vol. E83-B no. 3, pp 577-, Mar. 2000. (download from
John Barnes Advisory Engineer
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