Date: Mon Feb 26 2001 - 14:41:09 PST
I'd like to know if someone can validate some differential impedance
questions for me. Any help is appreciated.
I've got a board that's FR4 thru-out, except for the top layer which is
GETEK material (high speed lines, 2.5Ghz). Here's the recommended
1) Top layer uses .014" traces with .013" spacings/pair to achieve
100ohms differential signaling. (.012" dielectric thickness to the GND
plane running on the second layer) Stackup is preferred done with 1oz
(2.1mils finished plating thickness, top layer)copper thru-out. Are the
widths/spacings/thickness correct to get me 100ohms diff.?
2) What trace widths spacings should I use to achieve 100ohms
differential if I decrease the GETEK dielectric material to .006"
(separation to the GND plane)?
All helpful tips, tricks and "gotcha experiaences" are appreciated.
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