RE: [SI-LIST] : Feedback needed in TDR measurements

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From: [email protected]
Date: Tue Feb 13 2001 - 15:26:24 PST


Go check out http://www.tdasystems.com/

Aubrey Sparkman
Signal Integrity
[email protected]
(512) 723-3592

> -----Original Message-----
> From: Ozgur Misman [mailto:[email protected]]
> Sent: Tuesday, February 13, 2001 5:03 PM
> To: [email protected]
> Subject: [SI-LIST] : Feedback needed in TDR measurements
>
>
>
>
> Hello everyone,
>
> We have capital to put together a TDR analysis capability
> for high speed
> interconnect characterization. our focus is mainly BGA,
> leadframe and high end
> 1500+ I/O flip chip packages with interconnect length ranging
> from 2 mm to 20
> mm. As in any package construction vias, traces,
> solderballs, chip bumps etc
> make up a signal net.
>
> We are in the process of determining what equipment we would
> need to properly
> characterize interconnects ( at package level) with risetimes
> as low as 50~100
> picosecond. We would also include differential pair
> characterization as well
> since wee see the use of differential pairs at package level
> more and more.
>
> If you would send some feedback on your experience with TDR
> equipment, or a
> setup that works in high speed domain and provides good
> repeatibility, I would
> ver much appreciate your feedback.!.
>
> Thanks in advance
> Ozgur Misman
> Sr. Engineer/scientist
>
>
>
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