[SI-LIST] : Flip chip substrate characterization question

About this list Date view Thread view Subject view Author view

From: Yuan Li (YSLI@altera.com)
Date: Mon Jan 15 2001 - 14:23:15 PST


For case like Multiple bump pads are connected to multiple ball pads, how do you measure its Tpd using a TDR and how to simulate it?

Thanks in advance,

Yuan Li

begin 600 Yuan Li (E-mail).vcf
M0D5'24XZ5D-!4D0-"E9%4E-)3TXZ,BXQ#0I..DQI.UEU86X-"D9..EEU86X@
M3&D@*$4M;6%I;"D-"D]21SI!;'1E<F$@0V]R<"X[3W!E<F%T:6]N<PT*5$E4
M3$4Z4V5N:6]R(%!A8VMA9VEN9R!%;F=I;F5E<@T*5$5,.U=/4DL[5D])0T4Z
M*#0P."D@-30T+3<U,#@-"E1%3#M73U)+.T9!6#HH-#`X*2`U-#0M-C0Q.0T*
M0412.U=/4DLZ.SLQ,#$@26YN;W9A=&EO;B!$<BX[4V%N($IO<V4[0T$[.34Q
M,S0[56YI=&5D(%-T871E<R!O9B!!;65R:6-A#0I,04)%3#M73U)+.T5.0T]$
M24Y'/5%53U1%1"U04DE.5$%"3$4Z,3`Q($EN;F]V871I;VX@1'(N/3!$/3!!
M4V%N($IO<V4L($-!(#DU,3,T/3!$/3!!56YI=&5D(%-T871E<R!O9B!!;65R
M:6-A#0I%34%)3#M04D5&.TE.5$523D54.EE33$E`86QT97)A+F-O;0T*4D56
>.C(P,#`Q,3$X5#`P-#$S,EH-"D5.1#I60T%21`T*
`
end

**** To unsubscribe from si-list or si-list-digest: send e-mail to
majordomo@silab.eng.sun.com. In the BODY of message put: UNSUBSCRIBE
si-list or UNSUBSCRIBE si-list-digest, for more help, put HELP.
si-list archives are accessible at http://www.qsl.net/wb6tpu
****


About this list Date view Thread view Subject view Author view

This archive was generated by hypermail 2b29 : Tue May 08 2001 - 14:30:37 PDT