From: Chris Padilla (firstname.lastname@example.org)
Date: Wed Jan 10 2001 - 09:47:54 PST
It is called thieving and I've found so signifcant EMI results positive or
negative as a result. Just set a spacing criteria from any components like
"no closer than 500 mils to any componenet or trace or via or whatever."
If the board has lots of blank space to fill, the EMI team may wish to
consider making embedded caps with the free space and copper flood
depending on the reference plane nearby. I have found these caps to be of
significant importance in controlling emissions and they are basically "free!"
>I am working now on the copper balance issue we have on our PCBs. On the
>outer layer beneath the converter a copper surface is required (E
>shielding) which generates the copper balance issue on that particular
>layer and also throughout the stack up. Thus, the unpopulated copper
>space is filled with square or circle floating copper surfaces separated
>in-between. These squares are overlapping throughout the stack up. The
>question: what is the best copper geometry, its dimension and the
>spacing between these geometries ?. Copper balance requires as much
>copper as possible but EMC wants no floating copper and very weak
>coupling between noisy areas such as converter and any functional
>Your help is really appreciated,
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