From: Brian Seol (BSeol@tessera.com)
Date: Mon Nov 13 2000 - 17:07:08 PST
I have a simple question about the effects of the number of vias on the
power and ground plane inductance of multilayer packages such as PGA, BGA
and MCM. Can you please provide guidelines on the number of vias or
separation between two neighboring vias for the effective design of power
and ground planes.
I guess, plane inductance decreases upon an increase in the number of via
and inductance values decrease to a low asymptote when there is a large
enough number of vias. After this point, plane inductance increases caused
by decreasing the plane area due to vias. Is this right? need any
trade-off? Any comments will be appreciated.
B. Brian Seol
Signal Integrity Engineer
San Jose, CA, USA
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