From: Nozad Karim (firstname.lastname@example.org)
Date: Wed Nov 08 2000 - 10:00:49 PST
I received numerous emails requesting detail job description for the Amkor
positions posted yesterday. Here is the job descriptions:
Amkor Technology has two openings for experienced and an entry level Signal
Integrity and Package Characterization engineers.
Package Characterization Engineer:
You will be responsible for 3-D electrical package modeling and characterization
of leadframe and Ball Grid Array laminate products for high speed Digital and RF
This position requires BS/MS in Electrical Engineering, and two years experience
with electrical modeling tools such as ANSOFT, Pacific Numerix or other related
tools. Familiarity with SPICE and good programming skills in SUN/UNIX
"C" and "Perl" are also desirable.
Signal Integrity Engineer:
Provide signal integrity analysis and recommendations using state of the art EDA
and software tools. Individuals will be working in a consulting environment,
interfacing with customers and Package layout group. Train PCB designers in the
intricacies of designing for signal integrity.
The position will involve the following disciplines:
Ø I/O pin-out, power, and ground distributions
Ø Ground bounce analysis / SSN ( Simultaneous Switching Noise)
Ø Interconnect delay management at the Package and system level.
Ø Pre and post layout SI analysis. (Ringing, reflection and crosstalk
Ø Establish technical requirements and estimate project scope and duration.
MSEE is required, Ph.D. EE desired. Experience in high-speed design using CMOS,
ECL, LVTTL, PECL and experience in the signal integrity field. Experience with
IBIS and or SPICE modeling highly desirable. Tools experience in one of the
following tools, Zuken, Cadence-SpectraQuest, QUAD, Ansoft or Hyperlynx is
required but we will train engineers with high-speed hardware design experience
that wish to become SI engineers.
Sr.Dir; Design and Characterization
1900 S.Price Rd
Chandler, AZ. 85248
Tel:480-821-2408 Ex5325 email: email@example.com
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