[SI-LIST] : Best coppper fill pattern

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From: George Borkowicz (jbor@nortelnetworks.com)
Date: Fri Oct 27 2000 - 07:30:21 PDT


        Hi guys, an opinion question...

        When making standard two-signal-layer-between-two-reference-planes
        stackup board manufacturers tend to copper fill the areas on signal
layers
        with no signal traces. Anyone has an opinion on the best pattern
for
        the fill to minimize layer impedance variations?

        George Borkowicz

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