From: George Borkowicz (firstname.lastname@example.org)
Date: Fri Oct 27 2000 - 07:30:21 PDT
Hi guys, an opinion question...
When making standard two-signal-layer-between-two-reference-planes
stackup board manufacturers tend to copper fill the areas on signal
with no signal traces. Anyone has an opinion on the best pattern
the fill to minimize layer impedance variations?
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