Re: [SI-LIST] : Current flow limit for wire bonding

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From: Doug Brooks ([email protected])
Date: Thu Oct 05 2000 - 08:59:02 PDT

UltraCAD has published two papers that relate to this question. One
attempts to define an equation that relates current carrying capacity of a
wire and its related temperature rise to its cross sectional area, and the
other relates to fusing current. We have a freeware calculator that may
also be of help.

The articles are based on work that was done with copper traces, but gold
wire is probably similar, and the results are probably at least in the same
ball park.

You can find the articles and the calculator on our web site:
Follow the links to the articles and the calculators.

Doug Brooks

At 06:27 PM 10/3/00 -0700, you wrote:
>Dear All,
>Does anyone have some approximate numbers for the limit of current that will
>flow through the wire bonding for a power pad of the single chip package?
>If that depends on the number of wire, how many wire do I need to handle
>current of 3A in case of 25 micron diameter gold bond wire? Any comments
>will be appreciated.
>Brian Seol
>Tessera Inc.

Doug Brooks' book "Electrical Engineering for the Non-Degreed
Engineer" is now available. See our web site for details.
Doug Brooks, President [email protected]
UltraCAD Design, Inc.

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