Re: [SI-LIST] : Current flow limit for wire bonding

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From: Michael Nudelman (mnudelman@tellium.com)
Date: Wed Oct 04 2000 - 12:55:06 PDT


It hurts even to think of all that current flowing through 25mkm diameter wire.
I'm not sure I undestood the situation.

Mike.

Brian Seol wrote:

> Dear All,
>
> Does anyone have some approximate numbers for the limit of current that will
> flow through the wire bonding for a power pad of the single chip package?
> If that depends on the number of wire, how many wire do I need to handle
> current of 3A in case of 25 micron diameter gold bond wire? Any comments
> will be appreciated.
>
> Brian Seol
> Tessera Inc.
>
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