[SI-LIST] : Current flow limit for wire bonding

About this list Date view Thread view Subject view Author view

From: Brian Seol (BSeol@tessera.com)
Date: Tue Oct 03 2000 - 18:27:44 PDT


Dear All,

Does anyone have some approximate numbers for the limit of current that will
flow through the wire bonding for a power pad of the single chip package?
If that depends on the number of wire, how many wire do I need to handle
current of 3A in case of 25 micron diameter gold bond wire? Any comments
will be appreciated.

Brian Seol
Tessera Inc.

**** To unsubscribe from si-list or si-list-digest: send e-mail to
majordomo@silab.eng.sun.com. In the BODY of message put: UNSUBSCRIBE
si-list or UNSUBSCRIBE si-list-digest, for more help, put HELP.
si-list archives are accessible at http://www.qsl.net/wb6tpu
****


About this list Date view Thread view Subject view Author view

This archive was generated by hypermail 2b29 : Tue May 08 2001 - 14:29:39 PDT