From: Brian Seol (BSeol@tessera.com)
Date: Tue Oct 03 2000 - 18:27:44 PDT
Does anyone have some approximate numbers for the limit of current that will
flow through the wire bonding for a power pad of the single chip package?
If that depends on the number of wire, how many wire do I need to handle
current of 3A in case of 25 micron diameter gold bond wire? Any comments
will be appreciated.
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