[SI-LIST] : Current flow limit for wire bonding

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From: Brian Seol ([email protected])
Date: Tue Oct 03 2000 - 18:27:44 PDT


Dear All,

Does anyone have some approximate numbers for the limit of current that will
flow through the wire bonding for a power pad of the single chip package?
If that depends on the number of wire, how many wire do I need to handle
current of 3A in case of 25 micron diameter gold bond wire? Any comments
will be appreciated.

Brian Seol
Tessera Inc.

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