From: Ken Cantrell ([email protected])
Date: Tue Oct 03 2000 - 09:19:56 PDT
Donald,
Correct me if I'm wrong (Jim), but SQuest, or any of the other vendors other
than Innoveda(Quiet Ext), only do a differential mode emissions analysis.
This means that you are not able to analyze the Vcm created between the
board and the cable(s), where most of your emissions issues come from.
Don't get me wrong, I'm not pro-Innoveda either, I'm just a user. There are
issues with all of the packages. Innoveda XTK is antiquated and hard to
use, plus you have to buy XTK to support Quiet and AC/Grade. They should
have an XTK lite so that the user has a choice, or make Quiet and AC/Grade
stand alone. SQuest, HyperLynx, and ICX are more user friendly, but don't
do common mode. HyperLynx (PADS and Innoveda merged, so HyperLynx is under
the Innoveda banner now), deserves special note. If you are not designing
chips, just doing boards, it is the most user friendly and intuitive tool
out there, and it will do 90% of what you need to do at about 10% of the
cost. If you are in a multiple product line, manufacturing driven
situation, and are using Cadence, SQuest has a lot of elements that will
make your life easier. They make the most highly integrated (with CAD, Mfg,
and design)package. I also like the agressive pricing that Cadence started
about a year ago. They give you a lot of bang for the buck. I haven't had
the chance to review Mentor ICX yet, hopefully later this month. I've had
problems just getting the package in, both in Seattle and Springs. They
seem to be responsive on the phone or e-mail, but there is a disconnect
there somewhere. I have reviewed their FPGA sim pak, Advantage, and it is
very good. Detailed, but easy to use. I'm hoping their SI pak is as good.
User to user, Donald, the EDA industry is extremely competitive right now.
Each vendor leap-frogs the other just about every couple of months on
feature sets. I used to go for getting everything from one vendor, but now
I'm mixing and matching, typically doing the one year lease instead of the
lifetime buy.
Ken
Sim Manager
SRC Computers
-----Original Message-----
From: [email protected]
[mailto:[email protected]]On Behalf Of Jim Freeman
Sent: Monday, October 02, 2000 7:53 PM
To: Donald Telian
Cc: May, John; '[email protected]'
Subject: Re: [SI-LIST] : FW: Spectraquest Vs. XTK/XNS
The problem is that the Hspice models are using the M format.
Jim Freeman
Donald Telian wrote:
> John,
>
> Answers for SPECCTRAQuest are below.
>
> Thanks for asking,
> Donald T.
> CADENCE
>
> At 01:48 PM 9/25/00 -0400, May, John wrote:
> >
> >
> >> -----Original Message-----
> >> From: May, John
> >> Sent: Monday, September 25, 2000 1:20 PM
> >> To: '[email protected]'
> >> Subject: Spectraquest Vs. XTK/XNS
> >>
> >> Hi all - My group is looking into purchasing one of these tool suites
for
> >> SI analysis. I'm wondering what the tradeoffs and limitations of each
are.
> >> For instance:
> >>
> >> 1) Can botth suites handle HSPICE models in a mixed environment with
IBIS
> >> models?
> >>
>
> SPECCTRAQuest uses an optimized spice engine for analysis. As such, all
> types of spice models can be used with the exception of transistor-based
> models (M elements). Naturally, IBIS models can be used as well. If you
> want to use both IBIS and transistor-level IO models, we have a netlist
> converter that will translate our proprietary spice netlist (extracted
from
> PCB layouts or topology drawings) into a variety of other spice formats.
>
> >> 2) Do either of the tools have trouble with differential inputs(high
and
> >> low inputs used with a differential receiver)?
> >>
>
> SPECCTRAQuest has support for differential drivers and receivers.
>
> >> 3) Connector stitching: How easy is it to use these tools for going
> >> through connectors to model paths that traverse multiple modules?
> >>
>
> It is quite simple to join multiple board layout files together in
> SPECCTRAQuest for simulation. And that includes package layout (.mcm)
> files as well. A variety of connector or cable models can be easily
placed
> between the boards. The simplest being RLC or RLGC representations, but
> fully-coupled connector models can also be integrated into the simulation.
> This normally requires some re-formatting of the data from the connector
> vendor, but it is not too hard to do assuming you understand how to build
> and call spice subcircuits.
>
> >> John
> >
> >**** To unsubscribe from si-list or si-list-digest: send e-mail to
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> >
> >
> >
> Donald Telian
> Cadence Design Systems
> phone: 408-944-7791
> [email protected]
>
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