From: bgrossma ([email protected])
Date: Tue Sep 19 2000 - 09:24:14 PDT
Becky,
You may want to check out the IEEE EPEP and ECTC conference proceedings
as they tend to have topics similar to what you are looking for. I also
know that the HDI conference this year had a uVia tract that may have
some useful information for you.
Regards,
-Brett
Loop, Becky wrote:
>
> Hello members,
>
> I am looking for information on via and micro-via in pad technology. Has
> anyone investigated the signal quality impacts of using these new
> technologies? I am trying to look at the impact of the different laminants
> on the signal coupling, crosstalk, and general signal waveshapes in high
> speed design.
>
> Please let me know if you have any information.
>
> Thanks,
> Becky Loop
> Design Engineer/Electrical Design
> DPG/Desktop Platform Enabling
> Phone: (253) 371-4380
> Email: [email protected]
> Pager: (877) 342-3710
> Text Pager: [email protected]
> Intranet: http://pmd.dp.intel.com/~rloop
>
>
>
> **** To unsubscribe from si-list or si-list-digest: send e-mail to
> [email protected]. In the BODY of message put: UNSUBSCRIBE
> si-list or UNSUBSCRIBE si-list-digest, for more help, put HELP.
> si-list archives are accessible at http://www.qsl.net/wb6tpu
> ****
**** To unsubscribe from si-list or si-list-digest: send e-mail to
[email protected]. In the BODY of message put: UNSUBSCRIBE
si-list or UNSUBSCRIBE si-list-digest, for more help, put HELP.
si-list archives are accessible at http://www.qsl.net/wb6tpu
****
This archive was generated by hypermail 2b29 : Tue May 08 2001 - 14:29:32 PDT