Re: [SI-LIST] : Via and uVia in Pad Technology

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From: bgrossma (bgrossma@td2cad.intel.com)
Date: Tue Sep 19 2000 - 09:24:14 PDT


Becky,

You may want to check out the IEEE EPEP and ECTC conference proceedings
as they tend to have topics similar to what you are looking for. I also
know that the HDI conference this year had a uVia tract that may have
some useful information for you.

Regards,

-Brett

Loop, Becky wrote:
>
> Hello members,
>
> I am looking for information on via and micro-via in pad technology. Has
> anyone investigated the signal quality impacts of using these new
> technologies? I am trying to look at the impact of the different laminants
> on the signal coupling, crosstalk, and general signal waveshapes in high
> speed design.
>
> Please let me know if you have any information.
>
> Thanks,
> Becky Loop
> Design Engineer/Electrical Design
> DPG/Desktop Platform Enabling
> Phone: (253) 371-4380
> Email: becky.loop@intel.com
> Pager: (877) 342-3710
> Text Pager: 8773423710@pagenetmessage.net
> Intranet: http://pmd.dp.intel.com/~rloop
>
>
>
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