From: bgrossma (firstname.lastname@example.org)
Date: Tue Sep 19 2000 - 09:24:14 PDT
You may want to check out the IEEE EPEP and ECTC conference proceedings
as they tend to have topics similar to what you are looking for. I also
know that the HDI conference this year had a uVia tract that may have
some useful information for you.
Loop, Becky wrote:
> Hello members,
> I am looking for information on via and micro-via in pad technology. Has
> anyone investigated the signal quality impacts of using these new
> technologies? I am trying to look at the impact of the different laminants
> on the signal coupling, crosstalk, and general signal waveshapes in high
> speed design.
> Please let me know if you have any information.
> Becky Loop
> Design Engineer/Electrical Design
> DPG/Desktop Platform Enabling
> Phone: (253) 371-4380
> Email: email@example.com
> Pager: (877) 342-3710
> Text Pager: firstname.lastname@example.org
> Intranet: http://pmd.dp.intel.com/~rloop
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