[SI-LIST] : Via and uVia in Pad Technology

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From: Loop, Becky (becky.loop@intel.com)
Date: Wed Sep 13 2000 - 16:44:57 PDT


Hello members,

I am looking for information on via and micro-via in pad technology. Has
anyone investigated the signal quality impacts of using these new
technologies? I am trying to look at the impact of the different laminants
on the signal coupling, crosstalk, and general signal waveshapes in high
speed design.

Please let me know if you have any information.

Thanks,
Becky Loop
Design Engineer/Electrical Design
DPG/Desktop Platform Enabling
Phone: (253) 371-4380
Email: becky.loop@intel.com
Pager: (877) 342-3710
Text Pager: 8773423710@pagenetmessage.net
Intranet: http://pmd.dp.intel.com/~rloop

 

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