From: zanella, fabrizio ([email protected])
Date: Fri Sep 08 2000 - 05:54:44 PDT
There have been a few discussions lately about the merits of using 2 mils of
dielectric between a power and ground plane in a PCB in order to achieve
maximum decoupling. Some vendors were mentioned which can fabricate pcbs
with such a small spacing between the planes.
Assume boards which contain 2 mil plane-plane separation get tested at
voltage and temperature extremes, there could be the chance of shorts and
fires (the UL minimum plane to plane spacing is 3.8 mils). Can anyone
comment on this?
Thanks and regards,
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