From: Dave Hoover (email@example.com)
Date: Wed Aug 30 2000 - 07:03:40 PDT
When you say "after board assembly", does that mean
components will be present? Because that may preclude
and chemical bath immersion (micro etch included).
If that's the case, maybe brush plating would only
be possible. : /
Can you have the final finish electroless Nickel
covered by Immersion Gold? If so then you can solder
where you want the assembly and still have a fairly
decent corrosion and chemical resistant surface
(finger prints included-they should wipe off with
Dave Hoover (aka, Groovy)
--- C Deibele <firstname.lastname@example.org> wrote:
> I have an application where I cannot use a solder
> require that the copper be exposed. My main problem
> is that
> after board assembly, no matter how careful I
> assemble to
> boards (wearing rubber gloves, cleaning the copper),
> and slight oxidation occur to the copper.
> So, after I assemble a board, I would like to rinse
> copper with a mild acid that would remove the
> layer. Does anyone have any experience doing that?
> What/where should I try to procure this acid? Or am
> offbase in even thinking of using an acid?
> Craig Deibele
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