From: \ ([email protected])
Date: Fri Aug 18 2000 - 13:31:06 PDT
Hi - This would seem an excellent opportunity to appraise the community
of
the final stages
of the NCMS Buried Capacitance project I was fortunate to be a part of.
Fundamentally the research
efforts are complete, a design guide written by UMR is (I think)complete
and
a final report
is close to compellation.
Richard Charbonneau & I would like to take this opportunity to remind
the SI
Community of a workshop
on this subject that will include some of the folks who contributed to
this
research. Here is the title:
The National Center for Manufacturing Sciences and Embedded Decoupling
Capacitance Consortium
August 21, 2000 NIST Campus Gaithersburg, Maryland. I have attached a
copy
of the flyer for your
convenience.
For those of you attending the EMC conference it is only a short hop
away. I
encourage all to attend.
All will be revealed.
----- Original Message -----
From: <[email protected]>
To: <[email protected]>
Sent: Thursday, August 17, 2000 2:14 PM
Subject: Re: [SI-LIST] : Decoupling capacitors (again!)
> Larry:
>
> On the contrary, there are several things "special" about the Zycon/Hadco
> processes (note the plural, it does matter) that makes it not only work,
but
> work reliably. I'm drawing on my relationship (and my memory) with Zycon
> that goes back to 1989-1993 for the following; therefore, don't shoot me
if
> there are some minor misstatements. FYI, I first met Istvan Novak in
Hungary
> in 1993 while presenting the merits of Zycon's ZBC2000 (buried
capacitance)
> product in reducing EMI in high-speed designs (as part of the
Hewlett-Packard
> High-Speed Design seminar series).
>
> The original guideline (and a defacto requirement if you wanted to sell
your
> products in the commercial telecom market) was set by the Bellcore limits
of
> no less than 4 mils dielectric thickness. This level, based on thousands
of
> qualification tests on materials available back in the 1960s (and
continuing
> into the late 1980s), was also insisted upon by the US military and
aerospace
> industries.
>
> Zycon developed special techniques for generating a smoother (i.e., a
finer
> granular) finish that would still reliably bond to the core material and
NOT
> experience electromigration while still withstanding 500 VDC stress (a key
> requirement). This copper smoothing process is now sometimes referred to
as
> "double-treating." Superior bonding and laminating techniques also had to
be
> developed. It's my understanding that these processes are also patented.
>
> They then ran a formal series of qualification tests to obtain approval
from
> Bellcore that was then included within the specifications as an allowable
> exception for telecom products. To my knowledge, no other company has
that
> approval. Zycon holds multiple patents on the many processes, as well as
the
> formally qualified deviation from the 4-mil "minimum thickness." Is
anyone
> aware of any other company that produces a standard 2-mil core product? I
> think not, for the cited quality (and probably legal) reasons.
>
> I DO know that if you simply throw together a 2-mil sandwich with "normal"
> commercial foils, you will (not withstanding possible patent infringement
for
> anything less than 4 mils) typically experience voltage breakdowns, local
> delaminations (i.e., air pockets that could not be extracted with "normal"
> processes), and further degradation with field use caused by thermal
cycling.
>
> My current legal knowledge on this subject may be outdated, but patents
run
> for >20 years.
>
> Since it has taken a decade for buried capacitance to really take hold,
> perhaps Charles Grasso can give us an update since the
> excellent presentation
> of last fall at the BC confab (in Colorado, I think).
>
> Mike
>
> Michael L. Conn
> Owner/Principal Consultant
> Mikon Consulting
> (408)727-5697
>
> *** Serving Your Needs with Technical Excellence ***
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