Date: Fri Aug 18 2000 - 06:20:29 PDT
ST Microelectronics is looking for people to do design
and analysis of packages for high-speed ICs. The packages are
typically multi-layer BGAs in various technologies. Applications are
in high-speed communication. We are designing the packages, modeling
and then measuring the electrical performance. Potential locations in
Ottawa and in Dallas.
Please contact me directly
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