RE: [SI-LIST] : Effects of thieving on SI and EMC.....

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From: Rees, Roger R (roger.r.rees@intel.com)
Date: Tue Aug 08 2000 - 14:10:53 PDT


The thieving patterns guarantee plating uniformity. Some (high quality)
vendors have changed their process so they perform the plating operation
PRIOR to outer layer etch thereby eliminating the thieving requirement.
Granted this plates more copper and requires more copper to be etched, but
they claim a much better control of the plating uniformity.

Roger Rees

-----Original Message-----
From: Bill Owsley [mailto:owsley@cisco.com]
Sent: Tuesday, August 08, 2000 1:53 PM
To: SI LIST
Subject: Re: [SI-LIST] : Effects of thieving on SI and EMC.....

I've heard about this one... the cops call it the modus operandi or
something like that...
and the other is obvious - when your car is gone...
But someone is gonna come back with a lame description of the board
manufacturers need these things, little Cu dots like measles, to make the
etching work out better and pressing the lams together too. And if you
keep the measles far enough from your signals - no contagion (effects).
ps. there are other uses if one gets creative, that help control EMI.

At 08:12 AM 07/31/2000 -0700, Ray Anderson wrote:
>OK, I'll bite. Educate me, what is a thieving pattern,
>and an auto-thiever ????
>
>
>-Ray
>
>
> > Does anyone out there have a tool or reference
> > that would allow one to calculate the effects of
> > thieving patterns on signal integrity and EMC.
> >
> > I am trying to come up with appropriate rule sets
> > for driving an auto-thiever utility.
> >
> > Thanks for the help.
> >
> > MG
> >
>
>
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----------------------------
Bill Owsley
TMBU Compliance
919) 392-8341
owsley@cisco.com

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