From: Dima Smolyansky (firstname.lastname@example.org)
Date: Tue Apr 25 2000 - 09:36:05 PDT
Pat and All:
We have both instruments and use both approaches on interconnects, and they
both work. If your system is linear, either approach will work.
Interconnects are linear, except maybe for some exotic cases where we deal
with ferromagnetic or something like that. If your system is non-linear
(e.g., an active device), the crosstalk approach (approach #2) breaks down.
Again, both approaches should work fine for PCB interconnects.
In my experience, errors in differential impedance measurement (as any other
impedance measurement) more often have to do with the fact that the TDR
users sometimes don't have a good interface from the TDR scope to the DUT
(cables and probes) and sometimes do not know how to best utilize
calibration capabilities in the instrument. Also, picking a specific point
on the TDR trace where the measurement is taken can cause discrepancies.
Averaging over a short region of TDR trace may help reduce these
discrepancies; we participated in the industry round robin on impedance
measurements where averaging over a region removed practically all
discrepancies between the instruments and methods.
Hope that helps,
TDA Systems, Inc.
11140 SW Barbur Blvd., Suite 100
Portland, OR 97219
(503) 246-2282 (fax)
(503) 804-7171 (mobile)
The Interconnect Modeling Company(TM)
----- Original Message -----
From: Brent DeWitt <email@example.com>
Sent: Monday, April 24, 2000 8:16 PM
Subject: RE: [SI-LIST] : Differential TDR "Measurements"
> I'm not an SI guru (and I don't play one on TV) but;
> My first impression is that your method is the more confident one. Your
> method appears to "wrap up" more of the variables than the fab house. How
> is the fab house estimating the line to line coupling in the differential
> pair? It's possible to do accurately with a good model, but I would
> question if their model is rigorous.
> Best of luck Sir!
> Brent DeWitt
> > -----Original Message-----
> > From: firstname.lastname@example.org
> > [mailto:email@example.com]On Behalf Of Zabinski, Patrick
> > J.
> > Sent: Monday, April 24, 2000 6:45 PM
> > To: firstname.lastname@example.org
> > Subject: [SI-LIST] : Differential TDR "Measurements"
> > We're working more and more with differential signals,
> > and subsequently dealing with more differential printed
> > circuit boards (PCBs). Over the past few years, we've
> > had difficulty with several PCB vendors
> > trying to obtain a controlled impedance 100 ohm
> > differential pair.
> > The problem generally boils down to "who's measurement
> > do we believe"? We measure one impedance, while the
> > PCB vendor measures another.
> > We've done some digging, and there appears to be two
> > approaches to measuring differential impedance, and I'd
> > like to hear what folks have to say about them.
> > Approach 1: inject two signals of opposite polarity,
> > one into the true and one into the complement. The
> > complement signal is substracted from the true, and
> > you read the impedance just like a single-ended
> > measurement.
> > Approach 2: Inject one signal into the true trace and
> > record its signal. Then, inject a signal into the complement
> > trace and record its signal. Then, with the magic of
> > mathematics, compile these two different captured signals
> > into an effective differential measurement.
> > The equipment we have in-house uses Approach 1, while
> > nearly every board vendor we work with uses Approach 2.
> > Can anyone shed some light into the accuracies, sensitivities,
> > etc. of these two approaches? Are there cases where one
> > approach is better/worse than the other?
> > Thanks,
> > Pat
> > -----
> > Pat Zabinski ph: 507-284-5936
> > Mayo Foundation fx: 507-284-9171
> > 200 First Street SW email@example.com
> > Rochester, MN 55905 www.mayo.edu/sppdg/sppdg_home_page.html
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