From: Peters, Stephen ([email protected])
Date: Mon Apr 17 2000 - 13:52:06 PDT
I'll take a shot at answering. A board with an odd number of layers
is difficult to manufacture. Basically, to do this means removing
all the copper from one side of a fiberglass panel, thus leading to
warping due to unequal thermal expansion. I suggest a ten layer
stackup as follows:
5. PWR (+5)
9. PWR (-15)
With this stackup the adjacent PWR/GND layers (5 and 6) form a
relativly good decoupling cap. Route any signal referenced to the
-15v on layers 8 and 9.
> -----Original Message-----
> From: Robison Michael R CNIN [mailto:[email protected]]
> Sent: Monday, April 17, 2000 1:13 PM
> To: [email protected]
> Subject: [SI-LIST] : anybody fielding newbie questions??
> i hope that i'm posting correctly here. i'm laying out a board and
> thinking i'll have 9 layers:
> this means my power and ground planes aren't adjacent, but at
> least each signal is positioned next to a power/gnd plane. the
> board is 11" by 11" and running ALS for some lowspeed memory
> loading and memory access, and then a few F series chips to
> run at 25MHz, with some of the fast stuff as board I/O.
> any comments would be appreciated.
> thank you, miker
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