From: Krishnan S Rengarajan (email@example.com)
Date: Wed Mar 15 2000 - 03:19:18 PST
CDM 500V looks okay.
I think HBM for commercial apps would be 2 to 2.2KV, and 4.4KV for Miltary applications (CMOS ICs).
For printers, I have seen ESD zaps being applied as air discharge (from a distance
of few mm) and contact discharge(make contact with head). The contact discharge (as I recall)
used to be as high as 5-8kV, and the air discharge ~2-4kV.
I also know that print heads get really hot (>100C ambience for the chips), even with heat sinks -
dont know if that modifies the ESD requirements for the print head chip !! (Eg. No one would want to touch
a hothead anyway!!)
Jan Vercammen wrote:
> I have a question that concerns electrostatic discharge (ESD). I am asked to give ESD
> specs for a thermal printhead. The printhead is an assembly of a ceramic carrier and
> a large number of silicon chips. We have asked for a data interface based on CMOS LVDS
> (low voltage differential switching).
> I have no idea of the CMOS process, do I think it is not that advanced. Let us assume
> between 1.25 and 0.5micron.
> (1) Which figures should I specify for CDM (1R-200pf) and HBM (1.5kR-100pf)?
> (2) I have found figures of 1500V for HBM and 500V for CDM. Are these numbers acceptable,
> too high or too low?
> Thank you for your input.
> Jan Vercammen
> EMC/PCB Engineering Agfa-Gevaert NV Belgium
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