Re: [SI-LIST] : 10 layer board stackup Revisited

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From: Lee Ritchey ([email protected])
Date: Wed Feb 09 2000 - 08:14:36 PST


Put the ground planes back together.

Gary Steinkogler wrote:

> I went to a Certification/EMI House to find out where/why we were failing
> radiated emissions. There are 13 cables attached to my system - some
> shielded and some not. All the cables were hot - especially the video and
> audio cables.. After testing we determined it was our grounds on the pc
> board. We have 2 ground planes, with one of them being split, digital
> ground, audio gound, and video ground. The other ground is digital ground.
> You can view my system at www.dmida.com. Any type of filtering did
> nothing to reduce the emissions. I do not have a simulation package. Any
> suggestions?
>
> -----Original Message-----
> From: [email protected] [SMTP:[email protected]]
> Sent: Thursday, January 20, 2000 4:23 PM
> To: [email protected]
> Subject: [SI-LIST] : 10 layer board stackup
>
> I presently have an 8 layer board as follows:
>
> sig top
> grd
> pwr
> internal 1
> internal 2
> pwr
> grd
> sig bottom
>
> We failed radiated emissions. All clock/fast signals were routed on
> surface of board - since system is battery operated, ie keep the power
> consumption down. Routing these signals on inner layers will draw more
> power? Since we failed radiated emissions miserably, the plan is to now
> bury the clock signals on the inner layers. Emissions exceeded - out to
> 7th harmonic of clocks (19.66MHz - from which the following clocks are
> generated, 117.96MHz, 58.9824Mhz, and 29.4912MHz) Three other clocks
> are
> at 32.514MHz, 12.000MHz, and 24.576MHz. We are adding damping
> resistors.
> We are also adding 2 more signal layers to the board for the clock/fast
> signals - impossible to route clock signals on either internal 1 or 2,
> also under a time crunch. I am looking for advise on the board stackup
> for this now 10 layer board.
>
> Stackup as planned
>
> Sig top
> grd
> pwr 3.3V
> new layer for clocks/fast edge rates/repetitive
> internal 1
> internal 2
> new layer for clocks/fast edge rates/repetitive
> pwr 5V
> grd
> sig bottom
>
> Also checking into smaller decoupling capacitors - higher self-resonant
> frequency - presently my board has all decoupling capacitors with 0.1uF
> values.
>
> I have seen 10 layer stackups with pwr and grd layers separated by as
> many
> as 6 layers. I want to keep the pwr and grd layers close in my
> application
> for good board decoupling.
>
> Please email me at [email protected] as I will be offsite from my
> office for the next couple of weeks.
>
> Regards,
>
> Gary Steinkogler
>
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