[SI-LIST] : Embedded Capacitance Workshop a reminder

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From: Grasso, Charles (Chaz) (GrassC@LOUISVILLE.STORTEK.COM)
Date: Thu Feb 03 2000 - 15:26:02 PST


Hello,

Please find attached information regarding the NCMS Workshop
on Embedded Capacitance.

________________________________________________________________________

 <<NCMS.pdf>>

I have included the text below:
CONFERENCE DESCRIPTION: The development and use of Embedded Capacitance
Date: Feb 28-29th
Location: Tempe Arizona
CONTACT:
Text Description:
The Need:
The need for power-ground decoupling capacitance is nearly universal in
electronic circuits. Today, the solution to that
need is found in discrete chip capacitors. These devices provide a wide
range of capacitance values and many
excellent properties, such as stability over temperature and frequency and
reliability. However, use of discrete chip
capacitors also poses some fundamental problems - prob-lems such as the
significant cost of producing them in large numbers and the amount of
surface area they consume on the circuit board. In addition, few designers
or maintenance
engineers understand, with any rigor, how many decoupling capacitors are
truly required, how much capacitance they
should have, and where to locate them on the circuit. In response to these
inherent problems, and supported by
the findings of recent industry roadmaps, OEMs are now viewing embedded
passives technology as a promising
alternative to discrete passives in electronics manufacturing. Embedding the
capacitance in the circuit board frees up
space that can be used for other functions. The technology may also improve
performance and reliability by reducing
the number of solder joints and discrete capacitors, and the associated
failure modes. In addition, totalsystem cost
may also be lowered as a result of parts reduction and circuit integration.
However,efforts by one company - or even a small group of companies - do not
have high probability of success.
The case for a group effort was justified: the investigation of multiple
materials, with multiple fabricators,produces multiple chances for success,
with the efforts of each participant being highly leveraged.
The Project:
Recognizing the value of a collective solution, NCMS, together with more
than a
dozen partners, organized a collaborative effort aimed at advancing the use
of embedded capacitance technology for power supply decoupling. The goal of
the project was to encourage the development
and use of embedded capacitive materials in printed circuit boards. The
project team focused on the embedding of a single large (distributed)
capacitance within the circuit board. The team anticipates that this
capacitance will be utilized for power
supply decoupling. Commercially available materials and developmental
materials were evaluated
for compatibility with the circuit board manufacturing process, for
materials properties, for reliability, and for
their ability to perform the decoupling function. The project has thus taken
some of the first steps towards the
realization of embedded passives in organic substrates.
Workshop Goal:
This workshop will provide a forum in which program
results can be disseminated to a targeted group of industry
representatives. Specifically, members of the project team
and NCMS's program manager will offer workshop
participants information and facilitated discussions on the
following: goals and objectives, test vehicle design, mate-rial
test results, reliability test results, electrical test results
(decoupling and EMI), and modeling of the electrical
performance of embedded distributed capacitance (EDC).
Why attend:
* Learn when, where, how to use these new EDC materials
* Learn from PWB fabricators technical know-how and
lessons learned
* Learn recommended design guidelines
* Receive workshop proceedings
* Receive project final report at 60% savings
Who should attend:
Individuals responsible for:
* PWB Fabrication
* PWB Design
* Electronic Products Designs
High-Speed Digital Designers
should NOT miss this workshop.

The Embedded Decoupling
Capacitance Consortium
Members
StorageTek
Delphi Delco
Electronics Systems
Raytheon Systems
3M Corporation
E.I. DuPont de
Nemours Co., Inc.
Litton Advanced
Circuitry
HADCO
Merix
National Institute of Stan-dards
and Technology
Penn State University
University of
Missouri - Rolla
National Center for
Manufacturing Sciences
Tobyhanna Army Depot
A Workshop Conducted by:
The National Center for
Manufacturing Sciences
Embedded Decoupling
Capacitance Consortium
February
28-29, 2000
Fiesta Inn
Tempe, Arizona



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