From: Speer, Ewart ([email protected])
Date: Thu Feb 03 2000 - 11:48:46 PST
Dear List Members,
I have an eight layer board with four routing and four plane layers. The
stackup I have chosen is;
Primary side (signal) - contains all components
+5V (full plane)
Internal (signal)
GND (full plane)
+3.3V (full plane)
Internal (signal)
GND (full plane)
Secondary side (signal) - no components
I want to take advantage of the interplanar capacitance between planes GND
and +3.3V. What core thickness should I specify? At what dimension
(thickness of core) would I lose this advantage? Also, on the secondary
side under an FPGA I have a large copper fill area that carries +2.5V, can I
use the adjacent GND plane and this area fill for more decoupling. If so
what thickness of prepreg should I specify? I would like to maintain a
0.062" overall thickness of the PWB.
Thank you all,
Ewart Speer
Scientific Atlanta
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