From: Ray Anderson ([email protected])
Date: Fri Jan 28 2000 - 15:13:28 PST
Ravi Kaw, co-chair of this years EPEP conference asked me to post
this CFP to the list.
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Announcement and Call for Papers
9th Topical Meeting on Electrical Performance of
Electronic Packaging EPEP '00, October 23-25, 2000
Phoenix, Arizona
Sponsored by The IEEE Microwave Theory and Technique Society and
The IEEE Components, Packaging and Manufacturing Technology Society
Co-Chairs
Ravi Kaw John Prince
Agilent Technologies University of Arizona
e-mail: [email protected] e-mail: [email protected]
phone: 650-857-8452 phone: 520-621-6187
fax: 650-852-8676 fax: 520-621-2999
The general subject of the meeting is the electrical modeling, design, analysis, and characterization of electronic
interconnections and packaging structures. The following areas will be addressed:
** Package analysis, including numerical methods and algorithms;
** Electro-magnetic analysis tools; Advances in transmission-line techniques;
** Power distribution and package resonance; ** Switching noise in multi-layered structures;
** RF/microwave packaging structures and their electrical performance;
** Multilayer LTCC packaging for microwave applications;
** MMIC modules and high density packaging;
** Experimental characterization techniques and testing procedures;
** EMC/EMI sources & effects; prediction and measurement of radiation from
on-chip sources, inter-connect and package structures;
** Long distance propagation in large switching complexes;
** New and innovative interconnect and packaging structures and their electrical performance;
** Electrical design implications for low cost, high volume packaging;
** Packaging concerns for wireless communication, one chip radios, automotive radar systems;
** Performance of low cost packaging solutions for communications systems;
** Optoelectronic packaging; structure and system applications;
** Current and future issues related to on-chip interconnections;
** Router friendly models and modeling tools: accuracy & efficiency;
** Modeling and Design of high speed digital IO circuits: signal propagation and reception;
** Advances in modeling core switching noise, and design of novel solutions;
** On-chip power delivery and regulation; ** On-chip measurement techniques;
Paper Submission: Authors are invited to submit papers describing new technical contributions in the areas broadly
covered above. The original and three copies of a summary, not to exceed FOUR PAGES, in single column format,
including illustrations, are required for paper selection. All papers must be written in English. The title of the
paper and the names and affiliations of all authors, including complete mailing address, telephone, FAX numbers and
e-mail must appear on the first page of the summary, as well as a 35 word abstract. If the paper is accepted, the
summary will be reproduced (as is) in the meeting digest. Submission should be sent, no later than July 10, 2000 to:
EPEP '00, Engineering Professional Development
The University of Arizona
1224 N. Vine Street
Tucson, AZ 85719-4552
520-621-3054/5104 FAX: 520-621-1443 e-mail: [email protected]
Conference Location: The conference will be held at Radisson Resort & Spa Scottsdale, 7171 North Scottsdale Road,
Scottsale, Arizona 85253-3696, phone 480-991-3800. The hotel is holding a block of rooms for participants at a
special rate of $145.00 single or double occupancy plus tax. There is a one-time resort service charge of $5.00 per
person which covers check-in/check-out and $1.00 per room per night for a room attendant gratuity. These charges
will be placed on the individual room account. Reservations may be made by calling the hotel directly or the
Worldwide Reservation Center at 1-800-333-3333. Reservations must be made by September 21, 2000 to receive these
rates. After this time reservations will be accepted on a space available basis only. Please be sure to mention you
are attending the Electrical Performance of Electronic Packaging Conference. All reservations must be guaranteed
with one room night�s deposit in the form of a check or credit card. Check-in time is 4:00 p.m. Check-out time is
12:00 noon.
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