From: Mike Hughes (firstname.lastname@example.org)
Date: Thu Nov 11 1999 - 10:33:40 PST
Thanks for all the replies so far, they have been helpful.
To clarify a little: cost is always an issue, but for my application
(mixed-signal IC testing), board costs are a small fraction of the total project
cost. Also the intent of my question is to learn more about the theory, and then
apply what I can.
In my application I do not use signal layers between the planes. I typically use
5 mil spacing between power and ground.
Fill for required thickness
I've been wondering if I can use 4 mils or 3 mils to raise the plane
capacitance. I was planning on staying with FR4. As far as 2, 3 or 4 mils being
manufacturable is something that I didn't intend to discuss here, but I
appreciate any replies none the less. My main intention is to find out if
raising capacitance in this way can hurt decoupling. A second intention is to
learn more about determining decoupling requirements (effective area of
-- ================================ Mike Hughes Product/Test Engineer High Speed Conversion Analog Devices, Inc.
Phone 781-937-2370 Fax 781-937-1011 mailto:email@example.com http://www.analog.com ================================
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