From: [email protected]
Date: Mon Nov 08 1999 - 11:10:12 PST
Regarding your comment...
<<But in many cases, you could have just put the multiple vias in parallel
(not in a checkerboard pattern) and mounted a dumb old 0805 capacitor
on them. There would be almost as much improvement in the inductance
and you can skip the expensive part. That is because the inductance
is in the design of the vias, mounting pads and distance to the power
planes, with only a minor amount attributed to the capacitor.
One thing you may have overlooked in your commentary about multiple-via pads
for capacitor mounting is the mutual coupling effect between adjacent +/-
vias that will reduce inductance much more than paralleling like vias (i.e.,
all + or all -) in close proximity. The interdigitization (is there such a
word?) is the basic principal behind the AVX capacitor construction.
Granted, the amount of via inductance reduction may not exceed 50% (which
only translates to ~40% increase in SRF), but that may be what's needed for a
leading edge product. Unfortunately, the price tag makes one carefully weigh
the performance/cost tradeoff.
Michael L. Conn
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