From: sweir ([email protected])
Date: Wed Nov 03 1999 - 08:35:01 PST
What kind of package is it in?
What is your decoupling like?
What is your power plane / ground plane structure?
Can you put plane underneath most of the chip?
At 10:31 AM 11/3/99 -0500, you wrote:
>I have a problem with a microprocessor which appears to be radiating very
>strongly from the package. I've deactivated all other circuits ( pulled
>crystals, pins etc ) on the board. Additionally, the micro is held in reset,
>PROM's are pulled, but it's a noisy as heck. Close field probes ( both E and
>H field ) show the package to be the dominent source of radiation.
>The device has a maximum clock rate of 50 MHz, this is where we're using it.
>Clock it at 32 MHz and the emissions fall about 10 dB up to about 300 MHz,
>more above 300 MHz. Yes it's a CMOS device.......
>Am I stuck with putting a can over the chip? The product has a plastic
>package, so there is no shielding available at all.....
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