[SI-LIST] : Printed Circuit Design's 1999 Editorial Calendar

Ronda Faries (RFaries@mfi.com)
Wed, 21 Oct 1998 15:02:40 -0700

Dear listserve members:

Printed Circuit Design magazine is always interesting in publishing
technical articles written by knowledgeable engineers and designers of
printed circuit boards and related technologies. Folks just like YOU!

Whether you've written a white paper that would make an interesting
article, a full-length article that hasn't been published elsewhere or
you just have a great idea for an article, we're interested in hearing
from you. Simply e-mail your 100-500 word abstract or full-length
article to PCD Senior Editor Ronda Faries (rfaries@mfi.com). Unless
your e-mail arrives right at deadline (ouch!) or we're overwhelmed
with responses to this e-mail, you can expect a reply in 5-10 days.

Whether you'd like to write an article but can't decide on a topic or
you just want to see what's coming down the pike, check out our 1999
editorial calendar at the end of this message. Remember, we want YOU
to be a PCD author.

Regards,

Ronda Faries
Senior Editor
Printed Circuit Design
rfaries@mfi.com

----------------------------------------------------------------------

Printed Circuit Design's 1999 EDITORIAL CALENDAR

JANUARY
* Issue Focus: EMC
* Articles: ESD, EMC compliance, noise-fighting components, spread
spectrum clock generation
* Deadline: 11/6

FEBRUARY
* Issue Focus: Emerging Technologies
* Articles: High-density packaging, materials, what you can/can't do
with flex, EDA and the WWW
* Deadline: 11/27

MARCH
* Issue Focus: Signal Integrity
* Articles: Bypassing, skew and differential drivers/pairs, ground
plane discontinuities, inside-the-chip signal integrity techniques,
harmonics
* Deadline: 12/23
* Bonus Distribution: PCB DESIGN CONFERENCE WEST

APRIL
* Issue Focus: Data Exchange
* Articles: Constraint management, standards/specifications,
communicating data to manufacturing, CAD/CAM viewers
* Deadline: 1/22

MAY
* Issue Focus: Simulation/Analysis
* Articles: IBIS vs. SPICE, thermal analysis, multi-board system-level
analysis, assembly simulation, pros/cons of tool capabilities
* Deadline: 2/19

JUNE
* Issue Focus: DFM/DFT
* Articles: Virtual prototyping, test methods, DFA design
considerations, DFM case study
* Deadline: 3/26
* Bonus Distribution: PCB DESIGN CONFERENCE EUROPE

JULY
* Issue Focus: High-Density Interconnect
* Articles: Via formation, routing techniques, material properties
* Deadline: 4/23

AUGUST
* Issue Focus: RF & Microwave
* Articles: RF layout techniques, tool capabilities, DFM for RF and
microwave
* Deadline: 5/21
* Bonus Distribution: HDI Conference

SEPTEMBER
* Issue Focus: Productivity
* Articles: Time/project management, workflow, team building,
productivity metrics, 1999 Salary Survey
* Deadline: 6/25

OCTOBER
* Issue Focus: Libraries/Models
* Articles: Off-board interconnect modeling, benefits/drawbacks of
different types of models, thermal model issues, central vs. multi
library system
* Deadline: 7/23
* Bonus Distribution: PCB DESIGN CONFERENCE EAST

NOVEMBER
* Issue Focus: Hardware and OS
* Articles: Converting from UNIX to NT, mixed environments, how much
hardware do you really need?, networking, UNIX to NT script migration
* Deadline: 8/23

DECEMBER
* Issue Focus: Market and Business
* Articles: EDA market report, service bureaus market report, consulting
report, European and Asian market outlook
* Deadline: 9/24
* Bonus Distribution: PCB DESIGN CONFERENCE ASIA

---------------------------------------------------------------------------
For more information about PCD, author guidelines, or to request a complete
media kit, visit www.pcdmag.com.
To learn more about the PCD-sponsored PCB Design Conferences, visit
www.pcbdcon.com.

**** To unsubscribe from si-list: send e-mail to majordomo@silab.eng.sun.com. In the BODY of message put: UNSUBSCRIBE si-list, for more help, put HELP. si-list archives are accessible at http://www.qsl.net/wb6tpu/si-list ****