Do you know if there has been any research on the use of BGA's in an
Industrial
environment (-40C to +85C combined with moderate to severe shock and
vibration).
I am afraid the different tCE of the BGA and the PWB (FR4) over that
temperature
extreme will cause the balls to crack and fail.
Roland
Perez, Raul wrote:
> There is a Joint Industry Standard by both the IPC and the EIA on
> Implementation of Ball Grid Array and other High Density Technology.
>
> J-STD-013
>
> Check out these pages for more info.
> http://www.ipc.org
> http://www.eia.org
>
> rperezjr
> <><
>
-- Roland F. Portman BiT Microsystems, Inc. 48499 Milmont Drive Fremont, CA 94538(510) 623-2341 Ext 129 (510) 623-2342 Fax