Re: [SI-LIST] : bga

Roland F. Portman ([email protected])
Wed, 06 May 1998 10:39:13 -0700


Do you know if there has been any research on the use of BGA's in an
environment (-40C to +85C combined with moderate to severe shock and
I am afraid the different tCE of the BGA and the PWB (FR4) over that
extreme will cause the balls to crack and fail.


Perez, Raul wrote:

> There is a Joint Industry Standard by both the IPC and the EIA on
> Implementation of Ball Grid Array and other High Density Technology.
> J-STD-013
> Check out these pages for more info.
> rperezjr
> <><

Roland F. Portman
BiT Microsystems, Inc.
48499 Milmont Drive
Fremont, CA  94538

(510) 623-2341 Ext 129 (510) 623-2342 Fax

[email protected]