Re: [SI-LIST] : bga

Roland F. Portman (portman@bitmicro.com)
Wed, 06 May 1998 10:39:13 -0700

Raul,

Do you know if there has been any research on the use of BGA's in an
Industrial
environment (-40C to +85C combined with moderate to severe shock and
vibration).
I am afraid the different tCE of the BGA and the PWB (FR4) over that
temperature
extreme will cause the balls to crack and fail.

Roland

Perez, Raul wrote:

> There is a Joint Industry Standard by both the IPC and the EIA on
> Implementation of Ball Grid Array and other High Density Technology.
>
> J-STD-013
>
> Check out these pages for more info.
> http://www.ipc.org
> http://www.eia.org
>
> rperezjr
> <><
>

--
Roland F. Portman
BiT Microsystems, Inc.
48499 Milmont Drive
Fremont, CA  94538

(510) 623-2341 Ext 129 (510) 623-2342 Fax

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