Do you know if there has been any research on the use of BGA's in an
environment (-40C to +85C combined with moderate to severe shock and
I am afraid the different tCE of the BGA and the PWB (FR4) over that
extreme will cause the balls to crack and fail.
Perez, Raul wrote:
> There is a Joint Industry Standard by both the IPC and the EIA on
> Implementation of Ball Grid Array and other High Density Technology.
> Check out these pages for more info.
-- Roland F. Portman BiT Microsystems, Inc. 48499 Milmont Drive Fremont, CA 94538
(510) 623-2341 Ext 129 (510) 623-2342 Fax