1. "Characterization of Resistive Transmission Lines by Short-Pulse
Propagation," by Deutsch, Arjavalingam, and Kopcsay. IEEE Microwave and Guided
Letters, vol. 2 No. 1, January 1992.
2. "Short-Pulse Propagation Technique for Characterizing Resistive Package
Interconnections," by Deutsch, Arjavalingam, Kopcsay, and Degerstrom. IEEE
Transactions on Components, Hybrids, and Manufacturing Technology, vol. 15, no.
6, December 1992.
The technique has been in use at our Yorktown Heights (NY) research facility
for some time. I can't promise much more than that, as I have just gotten set
up to use the technique myself. Besides, the authors of the papers deserve
the credit for their work, not me. I hope the references are helpful.
Interconnect Technology & Qualification
IBM Global Procurement, B8UA/061, RTP, NC
Phone: 919-543-8804 Fax: 919-543-3642