[SI-LIST] : Package design position

Paul Y.F. Wu (paulw@prolinx.com)
Mon, 27 Oct 1997 12:16:14 -0700

Package Design Engineering position available at ProLinx Labs.

ProLinx Labs, located in San Jose, provides full design and
manufacturing services to customers for high performance (thermally
and electrically enhanced) BGA (Ball Grid Array) substrates.

We have positions available in Package Design Engineering, responsibility
includes hands on design of our ViperBGA substrates, utilizing
ProLinx's patented ViperBGA Designer software plus other commercial
CAD/CAM and design verification tools. SI modeling and measurement of
electrical performance to meet customer requirements.

Qualification: BS/MS/Ph.D. EE or equivalent. Understands electronic
design. SI know-how: modeling, VNA. Good computer skills. Good
team work spirit. Customer orientation.

We offer competitive salary, stock options, and benefits.
Please email to paulw@prolinx.com for consideration.