[SI-LIST] : CALL FOR PAPERS, 2nd International Workshop on SIGNAL

Treytnar Dieter (dtre@lfi.uni-hannover.de)
Wed, 22 Oct 1997 14:39:45 +0100

CALL FOR PARTICIPATION=20
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2nd INTERNATIONAL WORKSHOP ON

SIGNAL PROPAGATION ON INTERCONNECTS
May 13-15, 1998=20
Kurhaus-Hotel, Travem=FCnde, Germany=20

As a result ot the success of the 1st Workshop on Signal Propagation on In=
terconnects we=20
will continue this meeting with the "2nd International Workshop on Signal =
Propagation on Interconnects"=20
to be held in Travemuende, Baltic Sea Side, which will be sponsered by the=
IEEE Computer Society.=20
The aim and therefore the topics of the Workshop are in the main the same =
as in 1997 as seen below.=20
It is the intent of this workshop to report on recent developments and app=
roaches in the field of interconnect
simulation and measurement on chips as well as on boards and packages. We =
look forward to another=20
workshop where leading edge results will be shared and discussed by world =
class developers and=20
researchers in this field.

Main topics of the workshop will include, but are not limited to:=20

Delta-I-Noise=20=20
Broadband Measurement Techniques and Theory=20
Coupling Effects on Interconnects=20
Determination of Characteristic Parameters=20
Field Theory=20
Ground Bounce=20
Guided Waves on Interconnects=20
Measurement, Modeling, and Simulation of Inter-
connects inside of Packages=20
Non-Linear Modeling and Analysis=20
Propagation Characteristics on Signal and
Ground Lines=20
Radiation and Interference=20
Simulation Techniques for 2- and 3-dimensional Interconnect Structur=
es=20
Substrate Influence on Signal Propagation=20
Interconnects and Testing=20
Delay Testing with Coupling=20

Submission of abstracts:=20

A copy of an one or two page extended summary, including figures, should b=
e sent by=20
February 1, 1998 to the Program Chair or to the Co-Chair. Notification abo=
ut acceptance
will be given by March 1, 1998. The current and up-to-date information abo=
ut the
workshop can be found on the website http://www.tet.uni-hannover.de/SPI/sp=
i.htm.

The workshop will be held in English. The title of the contribution and th=
e names and=20
affiliations of all authors must appear on the first page of the summary. =
If the paper is=20
accepted, the summary will be reproduced, as is, in the workshop=B4s diges=
t. The
committee looks forward to your participation.

General Chair:=20
Joachim P. Mucha=20
University of Hannover=20
Institut f=FCr Theoretische=20
Elektrotechnik=20
Appelstr. 9A=20
30167 Hannover=20
Tel: +49 511 762 3201/3202=20
Fax: +49 511 762 3204=20
mucha@tet.uni-hannover.de=20
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Vice Chair:=20
Thomas W. Williams=20
IBM Corporation, Boulder=20
c/o University of Hannover=20
Laboratorium fuer Informationstechnologie=20
Schneiderberg 32=20
30167 Hannover=20
Tel: +49 511 762 5031=20
Fax: +49 511 762 5051=20
tww@lfi.uni-hannover.de

Program Chair:=20
Hartmut Grabinski=20
University of Hannover=20
Laboratorium fuer Informationstechnologie=20
Schneiderberg 32=20
30167 Hannover
Tel: +49 511 762 5030/5043
Fax: +49 511 762 5051
hgra@lfi.uni-hannover.de=20

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Co-Chair:=20
Petra Nordholz=20
University of Hannover=20
Laboratorium fuer Informationstechnologie=20
Schneiderberg 32=20
30167 Hannover=20
Tel: +49 511 762 5032=20
Fax: +49 511 762 5051=20
petra@lfi.uni-hannover.de=20
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Technical Program Committee:=20
W. Bandurski, Univ. Poznan (PL)=20
F. Canavero, Univ. Torino (I)=20
D. De Zutter, Univ. Gent (B)=20
H.-J. John, SNI, Paderborn (D)=20
E. Kuh, Univ. Berkeley (USA)=20
N. van der Meijs, Univ. Delft (NL)
J.P. Mucha, Univ. Hannover (D)=20
P. Nordholz, Univ. Hannover (D)=20
O.A. Palusinski, Univ. Arizona (USA)
H.-J. Pfleiderer, Univ. Ulm (D)=20
L.T. Pileggi, Carnegie Mellon (USA)=20
H. Reichl, FhG-IZM, Berlin (D)=20
K. Rei=DF, Univ. Karlsruhe (D)
A. Rubio, Univ. UPC Barcelona (E)=20
A.E. Ruehli, IBM, Yorktown Heights (USA)=20
J. Schutt-Ain=E9, Univ. Illinois (USA)=20
E. Sicard, INSA, Toulouse (F)
R. Velazco, TIMA, Grenoble (F)=20
D. Williams, NIST, Boulder (USA)=20
T.W. Williams, IBM, Boulder (USA)
Y. Zorian, AT&T Bell Labs (USA)=20