[SI-LIST] : Package prices and circuit elements values

Jose Luis Gonzalez Jimenez (jlgonzalez@eel.upc.es)
Thu, 9 Oct 1997 14:07:34 +0100

Hello everybody,

I'm doing a kind of qualitative study on some aspectos of SSO generation
and decoupling techniques. I need some general information about two
topics. I'll be happy if someone could give me some 'role of thumb' data
of...

i) Packaging costs

DIP or DIC
a) Through hole
b) SMD
PGA
a) Through hole
b) SMD
CLCC or PLCC
BGA
Flex TAB
Direct bondign on pcb board
a) By wire bonding
b) TAB
c) Solder balls (flip chip)

I'm only searching for comparative prices not for precise comercial ones.

ii) In the circuit bellow representing a typical (and very simplified)
power supply distribution system, what whould be the typical (or
reasonable) values for the components?

System Concectors Board Board Module
traces to boards traces planes

RS LS RC LC RB LB RPP LPP RM LM
----/\/\/-^^^-+-/\/\/-^^^-+-/\/\/-^^^-+-/\/\/-^^^-+-/\/\/-^^^---+
| | | | | |
| ) ) ) ) |
| ) L1 ) L2 ) L3 ) L4 +-----+
| Power | | | | |chip |
(V) Supply > R1 > R2 > R3 > R4 | |
| < < < < +-----+
| | | | | |
| =3D=3D=3D C1 =3D=3D=3D C2 =3D=3D=3D C3 =3D=3D=
=3D C4 |
| | | | | |
_ - - - - -
Low freq Mid freq High freq Module
dec. dec. dec. dec.
cap cap cap cap

Thank you very much.

Jose Luis Gonz=E1lez

____________________________________________________________________________

O O O Departament
O O O d'Enginyeria
O O O Electronica
U P C

Departament d'Engineria Electronica
UNIVERSITAT POLITECNICA DE CATALUNYA (UPC)
Modul C4, Campus Nord
c/. Gran Capita s/n 08034 BARCELONA (Spain)
telf. + 34 3 4016748
+ 34 3 4017476
fax. + 34 3 4016756
email. jlgonzalez@eel.upc.es
web: http://www-eel.upc.es
___________________________________________________________________________