07/07/97 07:48 AM
Please respond to firstname.lastname@example.org @ internet
To: si-list@silab.Eng.Sun.COM @ internet
Subject: +3.3,5-board stackup problem
Currently we are spinning a set of boards with +3.3v, +5v and gnd.
We are looking at 8 layers with a stackup as follows;
1 ----- top or top
2 ----- signal gnd
3 ----- gnd signal
4 ----- +5 +5
5 ----- signal signal
6 ----- +3.3v signal
7 ----- signal +3.3
8 ----- bottom bottom
A manufacturability problem exists with a non-symetrical plane stackup
as shown. In our system , most power runs off the +3.3v plane. (70%)
suggested a mesh for the +5v plane. Does anyone have experience with
mesh type power planes ?
How tight does the mesh have to be ? (for low inductance, good high
I understand I will be reducing the high frequency capacitance
between the +5v
and the gnd plane, but does anybody have any data indicating what affect
this will have ?, and what can I do to compensate, if anything.
Any papers out there on this subject? I have read some in the past
, but I looking
for current information/references.