RE: Power/ground connections/bypassing on ICs

Grasso, Charles (GrassC@LOUISVILLE.STORTEK.COM)
Wed, 7 May 1997 12:47:23 -0600

>I, for one, would never advocate running traces from the IC
>power/ground pins first to a bypass capacitor, and then on to the
power/ground planes.

This technique was published in Printed Circuit Design and I am
collecting data to prove
>the efficiency, or lack thereof!, of this technique.

Charles Grasso
EMC Engineer
StorageTek
Tel:(303)673-2908
Fax(303)661-7115

>----------
>From: Andy Ingraham[SMTP:ingraham@wrksys.ENET.dec.com]
>Sent: Thursday, May 01, 1997 12:24 PM
>To: si-list@silab.Eng.Sun.COM; si-list@silab.Eng.Sun.COM
>Cc: ingraham@wrksys.ENET.dec.com
>Subject: Re: Power/ground connections/bypassing on ICs
>
>Thank you to everyone who contributed to my question about power
>and ground connections to integrated circuits and filter/bypass
>capacitors.
>
>So then, is there no one here who advocates running traces from IC
>power/ground pins first to a bypass capacitor, and then on to the
>power/ground planes?
>
>I thought my question might have touched off some argument, or at
>least someone saying that it works in some cases. (Such as the
>person who last week told me to do this for mixed-signal devices
>that don't specifically need filtered power.)
>
>One reply mentioned removing the thermal reliefs from the vias.
>Is this a common practice? Does it really make a difference?
>
>Regards,
>Andy Ingraham
>