re:guide line of PCB placement to reduce EMI/SI problem

Norman Wong (nwong@nortel.ca)
06 May 1997 10:04 EDT

Hi JOHNLIN:

You could check out the following book. It has some guidelines on
component placement as well as track routing for high speed design.

Title: Printed Circuit Board Design Techniques for EMC Compliance
Author: Mark I. Montrose
Publisher: IEEE Press
ISBN: 0-7803-1131-0

Welcome to the radiating world :-)

Regards,
Norman Wong
Hardware Design Engineer
Nortel, Wireless Network, Ottawa

In message "guide line of PCB placement to reduce EMI/SI problem", LinJohn@mail.dec.com writes:

> Hello Mr./Ms. SI,
>
> Could somebody provide idea about how to arrange components on a PCB
> mother board to gain best in SI and EMI? For example,
> 1, place high speed component, like CPU, on one edge/corner of the
> mother board, lowest speed component on the other edge/corner, and
> middle speed on the between.
> 2. Group all components with same speed.
> 3. Avoid to cutting power/ground plane on the area of a group of
> components.
>
> I believe arranging components properly will benefit in reducing SI
> problem as well as EMI.
>
> Thanks in advance
> JOHNLIN
>