guide line of PCB placement to reduce EMI/SI problem

John Lin ([email protected])
Tue, 6 May 1997 13:38:10 +0800

Hello Mr./Ms. SI,

Could somebody provide idea about how to arrange components on a PCB
mother board to gain best in SI and EMI? For example,
1, place high speed component, like CPU, on one edge/corner of the
mother board, lowest speed component on the other edge/corner, and
middle speed on the between.
2. Group all components with same speed.
3. Avoid to cutting power/ground plane on the area of a group of

I believe arranging components properly will benefit in reducing SI
problem as well as EMI.

Thanks in advance