Could somebody provide idea about how to arrange components on a PCB
mother board to gain best in SI and EMI? For example,
1, place high speed component, like CPU, on one edge/corner of the
mother board, lowest speed component on the other edge/corner, and
middle speed on the between.
2. Group all components with same speed.
3. Avoid to cutting power/ground plane on the area of a group of
I believe arranging components properly will benefit in reducing SI
problem as well as EMI.
Thanks in advance