Module Hardware Design Engineer positions

Michael Chin (mikec@pegusis)
Tue, 1 Apr 1997 18:43:52 -0800

OPEN POSITIONS

MODULE HARDWARE DESIGN ENGINEER
SIGNAL INTEGRITY EXPERTISE
CPU MODULE PROJECT

DUTIES:

Be a technical contributor in the design and simulation of
next-generation high speed CMOS CPU modules. Interface with
ASIC, mechanical, thermal, and manufacturing engineers. Bring
a product from design, prototype, to production.

QUALIFICATIONS:

* Requires at least 5 years of industrial experience in the design
of high-speed digital systems
* Strong background in PCB design areas (SI, timing)
* Familiar with state-of-the-art design tools (e.g., HSPICE)
and simulation techniques.
* Familiar with Valid/Cadence schematic and PC layout tools are
preferred.
* At least a Bachelor's degree in EE or physics is required;
a Master's degree is preferred.

SEND RESUME TO: Sun Microsystems, Inc.
2550 Garcia Ave.
MS: USUN02-106
Mountain View, CA 94043-1100

ATTN: Vernon Bollesen
E-mail: vernon.bollesen@Eng.sun.com
FAX: (408) 774-8047

We are an Equal Opportunity Employer.

SUN Microelectronics
A Sun Microsystems, Inc. Business