Topic: Packaging for Japanese Portable Products
Speaker: Thomas W. Goodman, TechSearch International
Location: Wyndham Garden Hotel, 3350 Avenue of the Arts, Costa Mesa, Calif
Date: Thursday, 27 March 1997
Time: Dinner & Program 6:00 PM
$16.00, Students $8.00, Please RSVP to Misri Lal @ 714-447-2561
Is the electronics industry in Japan facing a packaging dilemma?
With the ever increasing push for higher I/O, today's leading edge devices
are pushing the limits of current technolgies.
This talk explores the current ststus of high-density mounting in portable
products and the trends for the use of peripheral fine pitch and area array
packages in the future.
Thomas W. Goodman is a Senior Analyat and Technology Manager at TechSearch
in Austin, Texas. He earned his BS in Polymer Science at Penn State, and
MS in Macromolecular Science and Engineering from Case Reserve University.
He has worked at Sony's Central Research Center in Yokohama, Japan,
and Motorola. Goodman holds several patents in the US and Japan, and
is a member of IEEE, CPMT, SMTA and IMAPS.
For reservations or information please contact:
Misri Lal @ 714-447-2561
Thanks to all who attended the 7th Joint Technical Societies meeting.
Rob Mannings talk on the upcoming landing of the Mars pathfinder
was very interisting. Jim Drehle descrbed the merger of the
ISHM and IEPS organisations into the IMAPS. The new organisation
will be bring together important aspects in the concept, design and
fabrication of electronic products in the years to come.
* _ _ _ _ _ _ _ International Microelectronic
|| | | |_| |_| |_ __ | | | And Packaging Society
|| | | | | | _| |_| |_ Orange County Chapter
Please direct e-mail questions about this meeting to
Bill Gaines, - firstname.lastname@example.org
International Microelectronic Electronic Packaging Society
Information about the IMAPS may be obtained via e-mail at