regards,
Larry Smith
Sun Microsystems
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>From [email protected] Wed Dec 18 08:11:51 1996
Date: Wed, 18 Dec 96 10:10:00 CST
From: [email protected] (Arthur Collard)
To: [email protected]
Subject: PBGA packaging
Hi All,
Does anyone have experience with PBGA type packaging related to noise/EMI
and suseptability?
I have concerns with the internal ground/pwr ring, trace spacing/width,
via size, package size ... etc.
Can anyone share with me their experience.
Do you know of alternatives of/to PBA package types for low noise??
regards
ac
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